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5SHX2645L0002 3HB012961R0001

5SHX2645L0002 3HB012961R0001 Insulated Gate Bipolar Transistor (IGBT) module5SHX
brand:ABB price:0
Product Details

5SHX2645L0002 3HB012961R0001 Insulated Gate Bipolar Transistor (IGBT) module


5SHX2645L0002 is a Insulated Gate Bipolar Transistor (IGBT) module produced by ABB, with 3HB012961R0001 as its specific order number. It is mainly used in medium-to-high power electronic conversion systems and industrial drive applications. The detailed information is as follows: 


1. Basic Product Overview

CategoryDetails
ManufacturerABB (a leading global provider of power and automation technologies)
Product TypeInsulated Gate Bipolar Transistor (IGBT) Module (half-bridge topology, typical for such models)
Order Number3HB012961R0001 (unique identifier for inventory, procurement, and after-sales)
Package TypeStandard industrial IGBT module package (typically with heatsink-compatible design for thermal management)

2. Key Electrical Specifications

  • Rated Voltage (Collector-Emitter Voltage, V₍CE₎₍Rₐₜₑₙₜ₎):
    Typically 1200V DC (common voltage level for industrial IGBT modules, suitable for medium-voltage power conversion scenarios).
  • Rated Current (Collector Current, I₍C₎₍Rₐₜₑₙₜ₎):
    Approximately 450A (continuous current rating under standard operating conditions; peak current capability is usually 2-3 times the rated current for short durations).
  • Power Dissipation (P₍ₗₒₛₛ₎):
    Typical value ranges from 1.5kW to 2.5kW (varies with operating temperature and switching frequency; requires matching heatsink for heat dissipation).
  • Switching Frequency:
    Optimized for medium-frequency applications, generally 1kHz to 20kHz (balances switching losses and conduction efficiency, suitable for industrial drives and inverters).
  • Gate Driving Requirements:
    Gate voltage range: Typically ±15V DC (positive voltage for turn-on, negative voltage for reliable turn-off); gate current: 10A to 20A (peak) for fast switching.

3. Performance & Functional Features

  • High Power Density:
    Adopts advanced IGBT chip technology and optimized packaging design, enabling high current and voltage ratings in a compact form factor, saving installation space in equipment.
  • Low Switching & Conduction Losses:
    Integrates low-loss IGBT chips and anti-parallel freewheeling diodes (FWD), reducing energy loss during operation, improving system efficiency, and lowering heat generation.
  • Built-in Protection Mechanisms:
    Equipped with overcurrent protection (OCP) and overtemperature protection (OTP) functions (some versions may include undervoltage lockout (UVLO) for the gate drive), preventing module damage due to abnormal operating conditions.
  • Excellent Thermal Stability:
    Uses high-thermal-conductivity substrate materials (e.g., ceramic-aluminum composite substrates) to enhance heat transfer efficiency, ensuring stable performance even in high-temperature industrial environments.

4. Operating Environment

  • Operating Temperature Range:
    • Junction temperature (Tⱼ): -40°C to +150°C (maximum allowable temperature for the IGBT chip; actual operation should be controlled below 125°C for long-term reliability).
    • Ambient temperature (Tₐ): -25°C to +85°C (requires auxiliary cooling if ambient temperature exceeds 60°C).
  • Humidity:
    5% to 95% relative humidity (non-condensing; avoid moisture intrusion to prevent insulation degradation).
  • Isolation Voltage:
    Typically ≥2500V AC (between the power terminal and the baseplate, meeting industrial safety insulation standards).

5. Application Fields

  • Industrial AC drives (e.g., high-power motor speed control for pumps, fans, and conveyors).
  • Medium-voltage inverters and converters (used in power transmission, renewable energy systems like wind/solar inverters).
  • Uninterruptible Power Supplies (UPS) for high-power backup power systems (e.g., data centers, industrial critical loads).
  • Welding equipment and induction heating systems (relying on its high current handling and fast switching capabilities).

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